India’s ambitious India Semiconductor Mission (ISM) continues to gain momentum with the recent approval of four additional semiconductor projects. These approvals, coming on top of six previously sanctioned initiatives, reflect the government’s determination to establish a robust domestic semiconductor manufacturing and packaging ecosystem.
Key Developments
The newly approved projects come from SiCSem, Continental Device India Private Ltd. (CDIL), 3D Glass Solutions Inc. (3DGS), and Advanced System in Package (ASIP) Technologies, with a combined investment of approximately INR 4,600 crore. These projects are expected to directly employ 2,034 skilled professionals while generating significant indirect job opportunities across the electronics value chain.
With these additions, the ISM now encompasses 10 projects across six states, accounting for total approved investments of around INR 1.60 lakh crore. This initiative is designed to address India’s rising semiconductor demand across sectors such as telecommunications, automotive, data centers, consumer electronics, and industrial applications, while advancing the broader goal of Atmanirbhar Bharat (self-reliant India).
Highlights of the Four Projects
● SiCSem (Odisha): In partnership with the UK’s Clas-SiC Wafer Fab Ltd., SiCSem will establish India’s first commercial silicon carbide (SiC) compound semiconductor fab in Bhubaneswar. With a capacity of 60,000 wafers and 96 million packaged units annually, the facility will produce SiC devices for applications spanning defense, electric vehicles (EVs), fast chargers, solar power inverters, and data centers.
● 3D Glass Solutions (Odisha): 3DGS will bring advanced semiconductor packaging and embedded glass substrate technology to India, including 3D heterogeneous integration (3DHI) modules. The plant will produce 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually, supporting high-performance computing, AI, RF, automotive, and photonics sectors.
● ASIP Technologies (Andhra Pradesh): In collaboration with South Korea’s APACT Co. Ltd., ASIP will establish a facility with an annual production capacity of 96 million units, focused on mobile devices, set-top boxes, and automotive electronics.
● Continental Device India Ltd. (Punjab): CDIL will expand its Mohali facility to produce high-power discrete devices including MOSFETs, IGBTs, and Schottky diodes. The plant will deliver 158.38 million units annually, targeting applications in EV charging, renewable energy, power conversion, and industrial electronics.
Industry Impact
The approval of these projects marks a strategic milestone for India’s semiconductor landscape, adding critical manufacturing and packaging capabilities to complement the nation’s chip design expertise.
Notably, the inclusion of India’s first compound semiconductor fab and an advanced glass-based packaging facility positions the country as a rising hub for next-generation semiconductor technologies. This development also enhances India’s ability to support global supply chains amid rising geopolitical and trade uncertainties.
In parallel, government-backed talent development programs and design infrastructure support for 278 academic institutions and 72 start-ups have already trained over 60,000 students, creating a skilled workforce pipeline for the semiconductor ecosystem.
Conclusion
India’s push to expand semiconductor manufacturing through ISM demonstrates a long-term strategy to secure supply chain resilience, attract foreign partnerships, and drive technological self-reliance. For global and domestic stakeholders alike, these developments represent new opportunities for collaboration and innovation across critical industries.
At Futuretech Components, as a trusted electronic components distributor, we closely follow these advancements to better serve our partners. By providing reliable, high-quality components and supply chain solutions, Futuretech is committed to supporting customers worldwide as the semiconductor industry undergoes rapid transformation.
